SK Hynix Sends Cutting-Edge 12-Layer HBM3E Memory Samples To NVIDIA For Qualification Tests

The industry-leading HBM manufacturer SK Hynix has sent samples of its 12-layer HBM3E process to NVIDIA for qualification testing.

The report comes from ZDNet Korea, which has disclosed that SK Hynix has decided to take the next leap in the HBM3E segment as the firm reaches the testing stages of its 12-layer HBM3E type. For those unaware, the 12-layer type within the standard is much superior, offering much higher capacity, running 36GB per stack compared to the 24GB of the 8-layer HBM3E. Moreover, it is said to be a more efficient process, but as far as we know, 12-layer HBM3E hasn't been implemented in the industry yet. If SK Hynix passes its qualification tests, it might debut with NVIDIA's upcoming H200 AI GPU.

It is important to note that SK Hynix has already seen approval for the 8-layer HBM3e stack, and experts do say that the company won't have an issue with the 12-layer type, and it is expected to be integrated soon into AI solutions. This means the firm would have a potential edge over other manufacturers in the industry, like Micron. Things are heating up in this part of the market, and with the increased competition, we should expect a massive layer of innovation.

Just recently, SK Hynix revealed that they have witnessed outrageous demand from the HBM sector, claiming that this year's supply is already sold out, and SK Hynix is already gearing up for a dominant FY 2025. This isn't surprising at all because AI is still witnessing a huge boom moving into 2024, and with firms such as NVIDIA and AMD preparing for next-gen solutions, it is evident that the demand for HBM will be huge as well.

News Source: ZDNet