SK hynix HBM3e Memory Now In Volume Production, Powering NVIDIA AI GPUs Later This Month

SK hynix HBM3e Memory Now In Volume Production, Powering NVIDIA AI GPUs Later This Month

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SK hynix HBM3e Memory Now In Volume Production, Powering NVIDIA AI GPUs Later This Month
SK hynix HBM3e Memory Now In Volume Production, Powering NVIDIA AI GPUs Later This Month 1

SK hynix has officially begun volume production of HBM3E memory and will be shipping it to customers such as NVIDIA later this month.

The volume production of HBM3E memory by SK hynix comes almost 7 months since the firm announced the development of the DRAM. Back then, SK hynix confirmed that its HBM3E DRAM will be utilized by NVIDIA and other partners to power their next-gen AI accelerators.

Press Release: SK hynix Inc announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company made public its success with the HBM3E development just seven months ago.

SK hynix being the first provider of HBM3E, a product with the best-performing DRAM chips, extends its earlier success with HBM3. The company expects successful volume production of HBM3E, along with its experiences also as the industry’s first provider of HBM3, to help cement its leadership in the AI memory space.

To build a successful AI system that processes a huge amount of data quickly, a semiconductor package should be composed in a way that numerous AI processors and memories are multi-connected. Global big tech companies have been increasingly requiring stronger performance of AI semiconductors and SK Hynix expects its HBM3E to be their optimal choice that meets such growing expectations.

The latest product is the industry’s best in all the aspects required for AI memory including speed and heat control. It processes up to 1.18TB of data per second, equivalent to processing more than 230 full-HD movies (5GB each), in a second.

As AI memory operates at an extremely high speed, controlling heat is another key qualification required for AI memories. SK hynix’s HBM3E also comes with a 10% improvement in heat-dissipation performance, compared with the previous generation, following the application of the advanced MR-MUF process.

Sungsoo Ryu, Head of HBM Business at SK hynix, said that mass production of HBM3E has completed the company’s lineup of industry-leading AI memory products. “With the success story of the HBM business and the strong partnership with customers that it has built for years, SK hynix will cement its position as the total AI memory provider.”

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