SK Hynix Begins 12-Layer HBM3E Mass-Production By This Month, Shipping The Next Quarter

SK Hynix plans to initiate mass production of its 12-layer HBM3E by the end of September, as the South Korean giant prepares for the next-gen AI markets.

HBM has played a crucial role in the progression of AI computing capabilities since it is regarded as an important component in the manufacturing of AI accelerators. Currently, the industry is focused on 8-layer HBM3E, which is featured in NVIDIA's Blackwell architecture; however, there is still a superior HBM3E variant existent in the markets, which focuses upon a 12-layer configuration that brings in higher memory capacities and transfer speeds.

SK Hynix has become one of the first firms to announce mass production of 12-layer HBM3E (via Reuters), stating that shipping is expected to begin by the next quarter. In terms of what the 12-layer HBM3E will bring onboard, it is said that the standard is much superior to existing HBM products, offering much higher capacity, running 36GB per stack compared to the 24GB of the 8-layer HBM3E.

Moreover, it is said to be a more efficient process due to the integration of the TSV (Through-Silicon Via) technology, which allows efficient data transfer and minimal signal loss. 12-layer HBM3E has not seen formal adoption by the markets yet, but it is rumored that NVIDIA will likely employ it in the "advanced" derivatives of Hopper and Blackwell AI GPUs,

It won't be wrong to say the fact that SK Hynix is one of the leading firms in the HBM industry since not only is the Korean giant witnessing massive demand from its customers, but the firm is continuously updating its arsenal of products. It is said that the firm's HBM production lines are booked until 2025, and SK Hynix is expected to witness continuous growth in the upcoming years, credits to the demand brought in by the AI frenzy.

To top it all off, the Korean giant is expected to introduce its cutting-edge HBM4 modules next year as well, with mass production expected by 2026. This particular memory standard is said to revolutionize the markets, especially since it will integrate HBM4 memory and logic semiconductors into a single package, which is one of the most highly anticipated features of the new memory type. HBM4 is often labeled as a "multi-functional" die, and it eliminates the need to use packaging technology.

The future looks great for the HBM markets, and they are expected to evolve rapidly in the upcoming quarters. However, it will be interesting to see how the involved firms compete against each other to reach the very top. By the looks of it, SK Hynix holds a huge gap from the likes of Samsung and Micron.