JEDEC Confirms CAMM2 Memory For Desktop PCs: DDR6 Up To 17.6 Gbps & LPDDR6 Up To 14.4 Gbps

DDR6 & LPDDR6 memory will feature super-fast speeds of up to 17.6 Gbps while the CAMM2 DRAM standard is headed to desktops.

JEDEC is all set to finalize the next-gen standards soon but it looks like early information is already available on what to expect from the next-gen standard.

The LPDDR6 memory will be replacing the existing LPDDR5 memory and its various iterations that were announced as early as 2019. It will be almost five years since the LPDDR5 standard has been out in the market. We have seen the likes of LPDDR5x from Samsung & Micron while SK hynix has also made an LPDDR5T variant which offers transfer speeds as high as 9.6 Gbps.

We have seen the adoption of the LPDDR5(X/T) variants in a range of other products with the most recent being the LPCAMM2 modules which are set to revolutionize the PC segment owing to their small modular form factor and offer increased capacity and upgradability options.

In terms of what to expect from LPDDR6 memory, Synopsys has laid out up to 14.4 Gbps as the highest defined data rate for the standard with an introductory rate of 10.667 Gbps. LPDDR6 will also use a 24-bit wide channel composed of two 12-bit sub-channels and offer an introductory bandwidth of up to 28 GB per second and up to 38.4 GB/s using the fastest 14.4 Gbps dies.

As for DDR6, it looks like the initial draft for the memory is said to be laid out this year with the v1.0 spec expected to be released by Q2 2025. As for memory speeds, the DDR6 memory standard will feature 8.8 Gbps introductory speeds and go all the way up to 17.6 Gbps.

It is expected that DDR6 will be further extended to 21 Gbps which is crazy high-bandwidth and NRZ is also mentioned over PAM signaling standard. Currently, the fastest DDR5 memory DIMMs can hit up to 9000 MT/s ram speeds and we have seen overclocks north of 11,000 MT/s but DDR6 memory would easily break past the 10K MT/s barrier without even needing to overclock and possibly over 20K MT/s with OC.

Another interesting topic to touch on is the CAMM2 memory standard which has been adopted by the likes of Micron, Samsung, SK hynix, and even Longsys, a Chinese manufacturer. CAMM2 is the next-gen standard which solves several problems with traditional SO-DIMM and DIMM memory such as upgradeability, repairability, motherboard complexity, and power consumption. It offers broad support from memory suppliers. Currently, CAMM2 is based on the DDR5, LPDDR5, and LPDDR5X standards with up to 256 GB capacities.

JEDEC has also talked about the next-gen LPDDR6 CAMM2 which will further refine the CAMM2 modules by offering the same fast speeds that we just mentioned above and also eliminate the need for screws which are required on existing designs.

The most important slide gives us an early look at future dual-channel CAMM2 memory solutions for desktop and server PCs. Instead of being placed vertically, the CAMM2 DIMMs will be housed horizontally, and up to two DIMMs are currently showcased.

CAMM2 eliminates the need for a soldered connector and moves the topology entirely onto the module. This new design is set to enable maximum performance and maximum capacities on the desktop PC platform.

It will require a brand-new approach to motherboards for sure and we don't expect designs to roll out soon but we can expect certain motherboard vendors, especially those who push the limits of memory through overclocking (2DIMM designs) to utilize CAMM2 DIMMs in the future. Definitely interesting times ahead in the memory segment so stay tuned for more information.

News Source: Many thanks to @DarkmontTech for the tip!