Intel To Hold IFS Direct Connect on February 21, CEO Talks Next-Gen Semiconductor Fabs & China

Intel To Hold IFS Direct Connect on February 21, CEO Talks Next-Gen Semiconductor Fabs & China

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Intel To Hold IFS Direct Connect on February 21, CEO Talks Next-Gen Semiconductor Fabs & China
Intel To Hold IFS Direct Connect on February 21, CEO Talks Next-Gen Semiconductor Fabs & China 1

Intel is all set to hold its flagship foundry event, IFS Direct Connect, in San Jose, California, where the company reveals the future of semiconductors.

The event will feature the likes of Intel's CEO Pat Gelsinger along with officials such as Stuart Pann, SVP and GM of Intel Foundry Services the event will focus on defining the strategy of the foundry for the future, and it is highly probable we will see an update on the ongoing developments on semiconductor processes such as the Intel's 20A which is expected to come under mass production in 2024. Along with that, expect some details to be shared regarding the firm's next-gen nodes as well, such as the 18A and beyond that as we enter the sub 2nm era.

Apart from semiconductor developments, Intel has mentioned plans to disclose information about the "world’s first AI system foundry", and it is said that this would lead the path for the future of semiconductors. While we are unaware of what an AI system foundry points to, it is most likely going to be a production source that is heavily influenced by the capabilities of AI. Intel's CEO Pat Gelsinger himself will disclose the specifics about it in a session titled "Siliconomy and the AI System Foundry: How Intel is At the Center of the Next Inflection Point".

This is cutting edge. When it comes online you know our most advanced process technology you that we're soon to bring into manufacturing what we call 18A (sub 2nm), you know this will be beyond that so this will be on the order of 1 and a half nanometer that will build in Magdeburg so this will be not only the most advanced manufacturing in Germany, it'll be the most advanced manufacturing in the world.

Pat Gelsinger (Intel CEO) - World Economic Forum in Davos via CNBC

Talking about China, Pat states that the gap between China's semiconductor adventures and that of the top fabs in the world is around 10 years.

The export policies that have been put in place, you know recently we've seen the Dutch in particular in place, the US policies, the Japanese policies, etc, it sort of puts a floor in the 10 to 7 nanometer range right you know for it and you know we are racing to go below 2 nanometers and then one and a half and you know we see no end to that in sight.

I see the policies in place and it's not like China's not going to keep innovating but this is a highly interconnected industry you know the staging of Trump right the mirrors of Zeiss, you know the equipment assembly of ASML, the chemicals and resistance technology in Japan, the mass making of Intel, all of those together you know I think this is a 10-year gap and I think it's a sustainable 10-year gap with the export policies that have been put in place today and I do believe that the portends well for the policies that have been established in the world for export and competitiveness in this environment and you know we're leaning hard into making sure that's the case.

Pat Gelsinger (Intel CEO) - World Economic Forum in Davos via CNBC

We have seen at CES 2024, & now in IFS press briefings that Team Blue says that it has positioned itself at an "inflection point" in the industry, which means that the firm will lead into the future of semiconductors, especially in the area where AI comes into play. It will be interesting to see what IFS Direct Connect holds for the tech industry, and as will make sure to keep an eye out for our coverages. The event is expected to be held by Feb 21, 2024, and will start at 8:30 PST with the keynote of Pat Gelsinger himself.

News Source: Intel

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