Intel Restructuring: Murthy Leaves, Ann Kelleher Takes Over 7nm And 5nm Development
Intel Restructuring: Murthy Leaves, Ann Kelleher Takes Over 7nm And 5nm Development

Some pretty big news out of Intel after market close today: Murthy, the person behind Intel's TMG efforts for a very long time, will leave the company effective August 3, 2020. TSCG (the official name for Technology, Systems Architecture and Client Group) will be broken up into five teams that handle R&D, Manufacturing & Ops, Design Engineering, Architecture, Software & Graphics, and Supply Chain respectively. Dr. Ann Kelleher will be taking over Murthy's role and will be in charge of the development for the 7nm and 5nm process.
TSCG is the collective that handles most of Intel's development and design tasks. This is a group that was led by Murthy and was technically responsible for the delays seen at 10nm and 7nm. It was likely that Intel would be undergoing some major restructuring when it stumbled a second time on 7nm and this appears to be the result. With a major separation of tasks, Intel's various teams will now be responsible only for their own domain and can theoretically choose the best possible candidate for the job (for eg, Raja can choose to go with TSMC instead of Intel's inhouse fabs).
The full text of the press release is as follows:
Effective immediately, the Technology, Systems Architecture and Client Group (TSCG) will be separated into the following teams, whose leaders will report directly to the CEO:
As a result of these changes, Murthy Renduchintala will leave Intel on Aug. 3, 2020.
“I look forward to working directly with these talented and experienced technology leaders, each of whom is committed to driving Intel forward during this period of critical execution,” said Swan. “I also want to thank Murthy for his leadership in helping Intel transform our technology platform. We have the most diverse portfolio of leadership products in our history and, as a result of our six pillars of innovation and disaggregation strategy, much more flexibility in how we build, package and deliver those products for our customers.”
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