AMD Strix Halo APU Details Leak: Twice As Big As Strix Point, Powerful RDNA 3.5 iGPU, Up To 120W TDP, Coming To ASUS ROG Flow Z13 In 2025

AMD Strix Halo APUs & GFX1151 iGPU Now Supported In ROCm, Offers Full AVX512 Width 1

AMD's Strix Halo APUs for enthusiast mobile platforms have been further detailed in a new leak which points out some interesting aspects of the chip.

The latest details come from multiple blog posts by thermal engineer and specialist, Sam Jiun-Wei Hu, who has worked on developing a new cooling solution for the ASUS ROG Flow Z13 (2025) PC tablet. This semi-tablet and semi-laptop design will be a powerful device with lots of performance thanks to the AMD Strix Halo APUs incorporated within it.

So let's start with the AMD Strix Halo die. Actual measurements of the Strix Halo package and each of the dies are provided. The entire chip is made of up three chiplets which include two Zen 5 CCDs and a singular GPU die featuring the I/O and memory controllers. The Zen 5 CCDs measure 66.345 mm2 and 70.6 mm2 if you include the die stiffeners. The CPU packages feature 8 cores per CCD for up to 16 cores and 32 threads based on the Zen 5 architecture. We also recently covered an 8-core Strix Halo configuration with up to 5.36 GHz clocks.

The iGPU die, measures 19.18 x 16.02mm or 307 mm2 which is larger than the whole Strix Point APU which measures 232.5 mm2. This is as big as a discrete GPU and we know why. The iGPU would be packing up to 40 RDNA 3.5 compute units which should offer some hefty performance.

For the whole Strix Halo die, the dimensions are 24.04mm x 19.78mm which equals 475.31 mm2, making it almost twice as large as the Strix Point APU. The bigger die is listed as the IOD and it is listed with a hotspot temperature of 86.6C which means that it won't be the Zen 5 CCDs but the RDNA 3.5 iGPU which will be the most power-hungry and thermal-intensive die on this chip.

Strix Halo CPU Die (Zen 5 CCD): 9.055mm x 7.327mm = 66.345mm2

Strix Halo IOD Die (RDNA 3.5 iGPU + IO): 19.18mm x 16.02mm = 307.26mm2

Strix Halo Complete Package Size: 24.03mm x 19.78mm = 475.31mm2

Strix Point Complete Die Size: 12.06 x 18.71mm = 232.51mm2

In the power breakdown, the different chiplets of the AMD Strix Halo APU are also detailed. Both Zen 5 CCDs (CCD0 & CCD1) have a maximum rated power of 15W each or 30W in total. The IOD which houses the RDNA 3.5 iGPU along with IO controllers is rated at 72W. The SO-DIMM memory is rated at 13W. So in total, you are looking at around 115W for the chip along with DRAM but the memory won't be an on-package design but rather the standard SO-DIMM configurations. These will come in 32 GB and up to 128 GB flavors.

Furthermore, the FP11 socket is also confirmed once again through official AMD documentation. At least three configurations of the AMD Strix Halo APUs are mentioned ranging from 55W, 85W & up to 120W. These configurations can be equipped with 32 GB (+5-9W) and up to 128 GB (+ 10-13W) memory. The memory type supported by Strix Halo is both SO-DIMM and LPDDR5X with up to 8533 MT/s speeds and 256-bit channels.

As for the iGPU, the AMD RDNA 3.5 solution with up to 40 compute units is compared to an Intel Raptor Lake and NVIDIA GeForce RTX 4070 (GN21) chip which also comes in 115W solutions. It is interesting to see the comparison between a high-end mobile discrete GPU and there's no doubt that AMD will push the boundaries of what's achievable with an integrated graphics solution in a chiplet design.

AMD Ryzen AI HX Strix Halo Expected Features:

Zen 5 Chiplet Design

Up To 16 Cores

64 MB of Shared L3 cache

40 RDNA 3+ Compute Units

32 MB MALL Cache (for iGPU)

256-bit LPDDR5X-8000 Memory Controller

XDNA 2 Engine Integrated

Up To 60 AI TOPS

16 PCIe Gen4 Lanes

2H 2024 Launch (Expected)

FP11 Platform (55W-130W)

The design listed in the leak is going to be one of ASUS's top ROG solutions, the ROG Flow Z13 which is both a tablet and a laptop. The 2025 design will feature a lot of thermal enhancements such as a Vapor Chamber with 1.3mm thickness, two cooling fans with up to 2000 RPM, proper ventilation, and the ability to run AMD's Strix Halo APUs at their full 120W configurations in a 13-inch design.

Following are the full details of the cooling design:

Vapor Chamber: Thickness: 1.3 mm Materials: Aluminum fins, stainless steel SUS304 body Weight Reduction: 10-22% lighter than previous designs

Thickness: 1.3 mm

Materials: Aluminum fins, stainless steel SUS304 body

Weight Reduction: 10-22% lighter than previous designs

Cooling Fans: CPU Fan: 7 mm height, 6.3 CFM GPU Fan: 7 mm height, 6.1 CFM Speed Increase: 1000-2000 RPM higher than previous models

CPU Fan: 7 mm height, 6.3 CFM

GPU Fan: 7 mm height, 6.1 CFM

Speed Increase: 1000-2000 RPM higher than previous models

Optimized Airflow: Fan Configurations: 12V rather than 5V for efficient cooling Heat Dissipation: 2.27 mm air layer between PCB and bottom case Ventilation: Nameplate holes for better surface temperature control

Fan Configurations: 12V rather than 5V for efficient cooling

Heat Dissipation: 2.27 mm air layer between PCB and bottom case

Ventilation: Nameplate holes for better surface temperature control

Thermal Management: Battery Configuration: Discontinuation of internal 5V fan Flow Field Optimization: Mylar and sponges Battery Temperature: Stabilized below 41°C during dual burns

Battery Configuration: Discontinuation of internal 5V fan

Flow Field Optimization: Mylar and sponges

Battery Temperature: Stabilized below 41°C during dual burns

Surface Temperature Control: Touch Screen: Below 48°C Bottom Case: Below 50°C

Touch Screen: Below 48°C

Bottom Case: Below 50°C

Acoustic Performance: Noise Level: 45 dBA during dual burns

Noise Level: 45 dBA during dual burns

AMD's Strix Halo APUs are expected to launch in 2025 alongside several other Zen 5 mobile products such as Fire Range & Krackan Point. These products will be incorporated in several laptops, tablets, handhelds, and Mini PCs throughout the coming year so expect lots of cool & innovative designs such as the ROG Flow Z13 next year.